NVIDIA Jetson T5000 Module

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ΚατασκευαστήςNVIDIA
Διαθεσιμότητα : Εκτός stock 0 Προϊόν(ντα)
Κωδικός προϊόντος :90-0015

Βάρος και διαστάσεις προϊόντος

Βάρος προϊόντος: 0.0280KG
4400,00 €
Χωρίς ΦΠΑ : 3548,39 €

Περιγραφή

NVIDIA Jetson AGX Thor Developer Kit 

Description

The NVIDIA® Jetson AGX Thor™ Developer Kit gives you unmatched performance and scalability. It’s powered by the NVIDIA Blackwell GPU and 128 GB of memory, delivering up to 2070 FP4 TFLOPS of AI compute to effortlessly run the latest generative AI models—all within a 130 W power envelope. Compared to NVIDIA Jetson AGX Orin™, it provides up to 7.5x higher AI compute and 3.5x better energy efficiency.

Jetson AGX Thor helps you accelerate low-latency, real-time applications with the new Blackwell Multi-Instance GPU (MIG) technology and a robust 14-core Arm® Neoverse®-V3AE CPU. It also includes a suite of accelerators, including a third-generation Programmable Vision Accelerator (PVA), dual encoders and decoders, an optical flow accelerator, and more. For high-speed sensor fusion, the developer kit offers extensive I/O options, including a QSFP slot with 4x25GbE, a wired Multi-GbE RJ45 connector, multiple USB ports, and additional connectivity interfaces. It’s also designed for seamless integration with existing humanoid robot platforms, allowing for easy tethering to jumpstart prototyping.

Jetson AGX Thor belongs to a new class of robotic computers, architected from the ground up to power next-generation humanoid robots. It supports a wide range of generative AI models, from Vision Language Action (VLA) models like NVIDIA Isaac™ GR00T N to all popular LLMs and VLMs. To deliver a seamless cloud-to-edge experience, Jetson Thor runs the NVIDIA AI software stack for physical AI applications, including NVIDIA Isaac for robotics, NVIDIA Metropolis for visual agentic AI, and NVIDIA Holoscan for sensor processing. You can also build AI agents at the edge using NVIDIA agentic AI workflows like Video Search and Summarization (VSS).

Our ecosystem of partners offers all the carrier boards, design services, cameras, and other sensors you need, as well as additional AI and system software to accelerate solution development in industries such as robotics, smart spaces, retail, industrial, medical, and more.

Massive AI performance and sensor capabilities in a compact form factor make the Jetson AGX Thor Developer Kit the ideal platform for developers looking to unlock new possibilities for humanoid robotics and other physical AI applications. 

 

Feautures

  • NVIDIA Jetson T5000 module with heat sink and reference carrier board
  • DC power 140W
  • 802.11ax wireless networkinterface controller
  • 1 TB NVMe populated in M.2 Key-M slot
  • Quick Start Guide

 

Technical information

  • AI Performance: 2070 TFLOPS (FP4—sparse)
  • GPU: 2560-core NVIDIA Blackwell architecture / GPU with 96 fifth-gen Tensor Cores / Multi-Instance GPU with 10 TPCs
  • GPU Max Frequency: 1.57 GHz
  • CPU: 14-core Arm Neoverse-V3AE 64-bit CPU / 64 KB I-Cache, 64 KB D-Cache / 1 MB L2 Cache per core / 16 MB shared system L3 cache
  • CPU Max Frequency: 2.6 GHz
  • Vision Accelerator: 1x PVA v3
  • Memory: 128 GB 256-bit LPDDR5X / 273 GB/s
  • Storage: Supports NVMe through PCIe / Supports SSD through USB3.2
  • Video Encode: 6x 4Kp60 (H.265) / 12x 4Kp30 (H.265) / 24x 1080p60 (H.265) / 50x 1080p30 (H.265) / 48x 1080p30 (H.264) / 6x 4Kp60 (H.264)
  • Video Decode: 4x 8Kp30 (H.265) / 10x 4Kp60 (H.265) / 22x 4Kp30 (H.265) / 46x 1080p60 (H.265) / 92x 1080p30 (H.265) / 82x 1080p30 (H.264) /4x 4Kp60 (H.264)
  • Camera: Up to 20 cameras via HSB /Up to 6 cameras through 16x lanes MIPI / CSI-2 / Up to 32 cameras using virtual channels / C-PHY 2.1 (10.25 Gbps) / D-PHY 2.1 (40 Gbps)
  • PCIe*: Up to 8 lanes—Gen5 / Root port only—C1 (x1) and C3 (x2) / Root Point or Endpoint—C2 (x1), C4 (x8),and C5 (x4)
  • USB*: xHCI host controller with integrated PHY / 3x USB 3.2 / 4x USB 2.0
  • Networking: 4x 25 GbE
  • Display: 4x shared HDMI2.1 / VESA DisplayPort 1.4a—HBR2, MST
  • Other I/O: 5x I2S/2x Audio Hub (AHUB), 2x DMIS, 4x UART, 4x CAN, 3x SPI, 13x I2C, 6x PWM / outputs
  • Power: 40 W–130 W
  • Mechanical : 100 mm x 87 mm / 699-pin B2B connector / Integrated Thermal TransferPlate (TTP) with heatpipe

 ** Το συγκεκριμένο προϊόν είναι διαθέσιμο μόνο κατόπιν προ-παραγγελίας

 

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